Industry Directory | Consultant / Service Provider
PCB Electronics Manufacturing Automation Software for EMS, OEM & ODM manufacturers. Over 3000 customers worldwide!
Industry Directory | Manufacturer's Representative
AlSi BondPads for PCB and Hybrid Packaging modules
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
New Equipment | Tape and Reel Equipment
Basic module for 1 type of component Easy changeover kit for tube loader (1 for each component type) Tube height adjustable thanks to precision screw Maximum height for tube 250mm Maximum width 33mm Length adjustable Feeding angle adjustable 5
Electronics Forum | Fri Oct 03 05:50:53 EDT 2003 | kanwal324
All the packages like 0603,0402,0201 have half the width as compared to length but in case of 0805 package width is 50 mils instead of 40 mils. Is there any special reason designing point of view. Please tell if anybody knows.
Electronics Forum | Mon Oct 06 04:03:39 EDT 2003 | iman
Does the EIA standard recommend any standard PCB pad sizes (LxB)? and pitch-to-pitch (Pad) distances? Thanks for the advise.
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2023-03-30 22:45:02.0
Taoyuan, Taiwan (February 27, 2023) – Heller Industries, a leading provider of reflow and curing ovens for SMT and semiconductor advanced packaging, today announced the opening of a new office in Taoyuan, Taiwan, to meet the growing demand for reflow and curing equipment in the Taiwan region.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | Component Packaging
Tenryu M6 P055 Nozzle in stock Place of Origin: China( Mainland ) Brand Name: Tenryu Nozzle Model Number: M6 P055 Nozzle zoey@jinchensmt.com
Parts & Supplies | Pick and Place/Feeders
Ball spline block head of Panaonic CM402 in stock ball spline N510015533AA BLOCK KIT N610037839AA CM402 H3 head Panasonic cm402 holder n610009409aa CM402 mounter head H8 head Panasonic cm602 holder Panasonic part n610011241ab CM cutter cylinde
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
www.unisoft-cim.com/solder.htm - The ProntoSELECTIVE-SOLDERING module from Unisoft is used by electronics manufacturers to generate the necessary programs for automatic PCB Selective Soldering machines in minutes. ProntoSELECTIVE-SOLDERING helps prog
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | New Orleans, Louisiana USA | Engineering,Technical Support
Electronic Technicians (2) If you have been searching for a beautiful place to relocate that also offers lots of activities on the weekend, this position may be your target. This client is located in New Orleans overlooking a beautiful lake that ma
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSEE a must, MSEE optional, 7+ yrs experience in RF wireless systems, preferably in a commercial enviornment. Duties/Functions: Provide technicl of customer requirements to the optimized of miniaturized RF/Wireless modules. Utili
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
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Speicherprogrammierbare Steuerung (SPS) in der Industrie EN Deutsch English productronica entdecken Messethemen PCB & EMS SMT Cables, Coils
WINTECH SERVICE & MARKETING SDN BHD | https://www.wintech.my/product/heller-34inc-module-oven-1912exl/
: HELLER , REFLOW / OVEN , SMT EQUIPMENT , SMT/AI EQUIPMENT HELLER 34INC MODULE OVEN 1912EXL SKU: 1912EXL In Stock HELLER 34INC MODULE OVEN MODEL
